FLEXIBLE PACKAGING MAJOR UFLEX DISPLAYING UNMATCHED TECHNOLOGY and INNOVATION AT PACK PLUS SOUTH 2016, HYDERABAD (INDIA)

FLEXIBLE PACKAGING MAJOR UFLEX DISPLAYING UNMATCHED TECHNOLOGY and INNOVATION AT PACK PLUS SOUTH 2016, HYDERABAD (INDIA)

India’s largest global flexible packaging company UFlex is participating at Pack Plus South 2016, Hyderabad – an event that will witness participation by over 150 companies featuring more than 50 product launches and over 100 running machines amid several other attractions. The exhibition is being held at HITEX International Exhibition Centre, Hyderabad from 02 to 05 March 2016.

On exhibit will be UFlex Chips Packing Machine CT-150 C that has been uniquely engineered to bridge the yawning gap of a high end – high speed machine for packing light weight potato chips and other light snacks. This machine which is low on energy consumption and space requirement yet delivering high output is all set to be a showstopper at Pack Plus South 2016.

FLEXIBLE PACKAGING

Yet another interesting display from UFlex would be a state-of-the-art Pick Fill & Seal (PFS) Machine that assumes the contours of a human robot. With a delightful ease, this machine performs repetitive actions of picking a pouch, opening it up using the fingers, filling the desired quantity of products and sealing it in a rotary index motion controlled through Geneva Cam. This top class product coupled up with impeccable customer service is an optimal offering from UFlex.

UFlex is renowned world over for its end to end flexible packaging solutions and possesses the capability to process any quantum of order and ensuring just in time deliveries. At Pack Plus South 2016, UFlex would also highlight brand protection and anti-counterfeiting solutions that keep the look-a likes at bay and prevent them from eroding brand equity.  On display at this exhibition would be different types of Holograms {analog 2D/3D conventional, Dot matrix (up to 24,000 DPI); non-diffractive Litho (up to 1,20,000 DPI) and E-Beam}; Unigrams Latentograms Wide Web Holographic Films {Soft embossing films, Hard embossing films, UV embossing films, High Refractive Index films, Windows/ De-metallized and Lens films}. UFlex will also showcase the Thermal Holography Films and demonstrate its applications in the Print Lamination Area. Also on display will be  Holographic Pouches, Holographic Strips Labeling solutions using foils, Fresnel lens and holographic effects {Printed Labels, Tamper Evident Security Labels, Anti-counterfeit Labels, Bar-Code Labels, Scratch Labels, Thermal Transfer Labels, Serial Number Labels, Holographic Labels}; Hot and Cold Stamping Foils for Graphics (Cartons & Labels).

Soon upon the inauguration of Pack Plus South 2016, Mr. Ashok Chaturvedi, Chairman & Managing Director, UFlex Limited in an official statement said, “Being on the driving seat of cutting edge technology in the realm of flexible packaging, UFlex always evaluates the merits of its product offering with respect to a thorough need gap analysis of the prevailing market situation and then systematically plugs those gaps with products especially engineered to meet the requirements. I am glad to display the most contemporary and innovative flexible packaging solutions at Pack Plus South 2016 with a hope that the industry as a whole will truly benefit through the shared learning by all players.”

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