Flex Films Presents the ‘Future of Packaging’ at PACK EXPO, USA – Reports IFCA Magazine | December 2018 Print Edition Post author:uflexltd-admin Post published:January 7, 2019 Post category:Blog Post comments:0 Comments Read more articles Previous PostUS Patent Granted to FlexFilms for Breakthrough BOPET Film Used for Alu Alu Blister PackNext PostGovernor of Kentucky The Honourable Matt Bevin Visits UFlex Plant in India You Might Also Like UFlex Conferred With ‘World’s Greatest Brand, 2015 – Asia & GCC’ CMD, ASHOK CHATURVEDI onored with ‘World’s Greatest Leader, 2015- Asia & GCC’ December 14, 2015 Effective Packaging Designs – Drivers to Grab Buyer’s Attention March 18, 2013 Packaging Gets Grey Matter Deploying Near Field Communication (NFC) July 19, 2017 Leave a Reply Cancel replyCommentEnter your name or username to comment Enter your email address to comment Save my name, email, and website in this browser for the next time I comment. Enter your website URL (optional)
UFlex Conferred With ‘World’s Greatest Brand, 2015 – Asia & GCC’ CMD, ASHOK CHATURVEDI onored with ‘World’s Greatest Leader, 2015- Asia & GCC’ December 14, 2015